Intel wants to be inside — everything.
That’s the message coming from Intel’s CEO Brian Krzanich. In a 2014 Consumer Electronics Show (CES) keynote delivered Monday night, Krzanich demonstrated an array of innovative technologies from Intel that firmly place the silicon giant at the forefront of the new wearable computing and mobile technology revolution.
At the core of Krzanich’s keynote was the announcement and demonstration of new silicon called Edison, which is based on Intel’s Quark effort that brings x86 computing down to the embedded computing form factor. The Edison is the size of a standard SD-flash memory card and provides what Krzanich describes as Pentium-class computing capabilities. Edison is a 22-nanometer process based chip and initially will be available with a dual core and include Wi-Fi and Bluetooth connectivity options. Edison will be at the core of a host of new smart connected devices that Intel want to help bring to market.
Read more at Datamation: http://www.datamation.com/mobile-wireless/intel-ceo-debuts-new-wearable-tech-at-ces-2014.html?google_editors_picks=true
